Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 35 min working time. Works in a mix ratio of 3:1. Delivers great performance with a shear strength of 2680 psi. Each package contains 1 lb. This potting & encapsulating compound is packaged 1 lb per inner.
SPECIFICATIONS
- Brand: Devcon
- Chemical Base: Epoxy
- Material Compatibility: Metal
- Dielectric Strength: 25 V/mil
- Cure Time: 16 hr
- Working Life: 35 min
- Product Form: Paste
- Package Size: 1 lb
- Mix Ratio: 3:1
- Shear Strength: 2680 psi
- Storage Condition: Store at Room Temperature
- Package Quantity: 1 lb per inner