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The Devcon 14350 is a epoxy adhesive with a mix ratio of 57:43.
The Devcon 14350 Features:
- 25-minute working time
- Bonds metals, FRP composites, rigid plastics, concrete, glass, and wood
- Non-corrosive
- Ideal for potting and encapsulating electronic components
The Devcon 14350 Specifications:
- Brand: Epoxy Plus™
- Product Type: Epoxy Adhesive
- Hardness: 74Shore D
- Material Compatibility: Metal, Ceramic, Rigid Plastic, Wood, Glass, FRP Composite
- Color: Thick White
- Primary Color: White
- Mix Ratio: 57:43
- Physical Form: Liquid
- Cure Time: 30h
- Viscosity Measurement: 70000cP
- Chemical Composition: Tris-2,4,6-(Dimethylaminomethyl)Phenol, Amorphous Silicon Dioxide, Butadiene Acrylonitrile Copolymer, Titanium Dioxide, Dimer/Tofa, Reaction Products With Teta, Aminoethylpiperazine, Nonylphenol, Bis(Dimethylaminomethyl)Phenolc
- Specific Gravity: 1
- VOCs Content: 0g/L
- Odor: Mild Phenolic
- Peel Strength: 20 to 25pli
- Cure Type: Room 75°F
- Dielectric Strength: 550V/mil
- Elongation at Break: 20%
- Maximum Operating Temperature: +200°F
- Minimum Operating Temperature: -40°F
- Container Capacity: 400ml
- Container Type: Cartridge
- Applications: Bonding, Potting, Encapsulating